Contract analysis
Clause-by-clause risk read on any document of the firm. Pick a contract, or open any document from a matter.
Contract analysis / us-local-file-hsi-fy2022.docx
us-local-file-hsi-fy2022.docx
High · 1
Medium · 0
Standard · 0
1. Tangible Goods (Wafer/Die Sales). HSAG manufactures semiconductor wafers and singulated
1. Tangible Goods (Wafer/Die Sales). HSAG manufactures semiconductor wafers and singulated die at its advanced-node fabrication facilities in Saxony, Germany: Fab 1 and Fab 2, located at Industriepark Klotzsche, Zur Wetterwarte 50, 01109 Dresden, and Fab 3, located at Technologiepark Chemnitz, Annaberger Straße 240, 09125 Chemnitz. During FY 2022, HSAG sold semiconductor wafers and singulated die to HSI under the Mas
2. Royalties (IP License). HSI paid HSAG a running royalty of 6.0% on IP-attributable reve
2. Royalties (IP License). HSI paid HSAG a running royalty of 6.0% on IP-attributable revenues under the intellectual Property License Agreement (the "IP License Agreement"), which became effective on January 1, 2019. The IP License Agreement grants HSI the right to use HSAG's proprietary semiconductor process technology, design libraries, electronic design automation ("EDA") tool integrations, and related intangible
3. Cost-Sharing Contributions (R&D CSA). HSI participates in a Qualified Cost Sharing Arra
High
⚑ Non-compete / exclusivity restraint
3. Cost-Sharing Contributions (R&D CSA). HSI participates in a Qualified Cost Sharing Arrangement (the "CSA"), effective July 15, 2018, with HSAG. Under the CSA, HSI shares in the costs and risks associated with the development of next-generation 2-nanometer ("2nm") and sub-2nm semiconductor process technology. HSI's anticipated benefit share under the CSA is 22.5%, reflecting its proportionate share of anticipated b