FR EA

Extract to table

Pull the structured facts out of a document: parties, dates, amounts, obligations.

Extract to table / post-markman-viability-678-patent.docx
post-markman-viability-678-patent.docx · 1014-00003

Parties

Harkness LLP
Optiwave Semiconductor Corp
Festo Corp
Epitech Compound Semiconductor GmbH
Raytek Corp

Dates

February 22, 2023
February 17, 2023
February 24, 2023
June 22, 2018
June 29, 2021
December 31, 2022
August 15, 2022
May 5, 2022
November 18, 2022
December 16, 2022

Amounts

$1,200
$1,800
$600
$900
$148.6

Obligations

it is the WDM element that must be monolithically formed, not the entire optical transceiver or every component on the die
Claim 2 depends from Claim 1 and adds a limitation specifying that the WDM element must be configured to handle at least four optical channels with a wavelength spacing of no greater than 800 GHz
Because all limitations of the independent claim must be satisfied for a dependent claim to be infringed, see Wahpeton Canvas Co
This additional limitation further emphasizes monolithic integration, specifying that the photodetectors must also be monolithically integrated on the same die as the WDM element
Claim 9 depends from Claim 1 and adds a limitation specifying that the transceiver must operate at an aggregate data rate of at least 400 Gbps using a specified coherent modulation format (DP-QPSK or DP-16QAM)
Claim 14 depends from Claim 1 and adds two further limitations: (1) the electronic driver circuitry and transimpedance amplifier ("TIA") circuitry must be co-integrated with the WDM element on the single silicon die; and (2) the WDM element must be evanescently coupled to at least one optical modulator through a tapered silicon waveguide