Extract to table

By fabricating these components as part of the same semiconductor manufacturing process on a common silicon substrate, the patented architecture eliminates the need for separate optical components that must be hybrid-integrated or flip-chip bonded to the transceiver assembly

" The three categories of components that must be formed during the "common" process are explicitly enumerated: WDM elements, modulators, and photodetectors

This argument has stronger textual support than the corresponding argument for Claim 1, because Claim 9 explicitly enumerates the three categories of components that must be formed in the common process and does not list light sources

Under the anticipated narrow defense construction — in which the entire transceiver must be free of any heterogeneous integration — this limitation is not met

The key question would then be whether the "wavelength-specific light source" recited in sub-element (a) of Claim 1 must be on the silicon die, or whether it can be provided externally