Extract to table

The unique constraints of photonic IC fabrication present several challenges not encountered in electronic IC cooling: (1) optical waveguides and resonant structures are sensitive to mechanical stress and strain, which can alter the effective refractive index and degrade optical performance — bonding or forming cooling structures adjacent to the PIC substrate must therefore be accomplished without introducing excessive stress; (2) the fabrication processes used for micro-channel formation must be compatible with the materials and process temperatures used in silicon photonics fabrication, particularly avoiding temperatures that could damage or shift the optical properties of waveguides and active components; (3) the micro-channel cooling structure must not interfere with the optical input/output coupling (whether via fiber attachment, grating couplers, or edge couplers) or with the electrical interconnections on the PIC; and (4) the coolant must be compatible with the photonic device materials and packaging, presenting no risk of corrosion, contamination, or optical surface degradation

§ 282 and to the clear-and-convincing-evidence standard that Lumicore must satisfy to establish invalidity